Pay in 4 interest-free payments of $8.50 Learn more
Shipping Estimate
USA
- USA
- CAN
- USA
- CAN
Ships within 48 hours · Estimated delivery Sep 12 - Sep 17
Pay in 4 interest-free payments of $8.50 Learn more
Ships within 48 hours · Estimated delivery Sep 12 - Sep 17
and then swipe both sides of the screen with a blade
Suitable for most mobile phone screen separation
1x A14 stencil
Fahrenheit ℉)
Handle Line Length: about 1
JTX Swap Board CPU Chip Reballing Platform for iPhone 8-16 Pro Max Machine vision camera and then swipe both sidesJTX SM 01 Swap Master 30 in 1 Tinning Platform with BGA stencil for iPhone 8 16 Pro Max motherboard replacement and CPU BGA chip reballing. Super Magnetic Positioning Tinning Platform for iPhone PCB board swapping chips rapid positioning, allows for reballing of multiple chip sizes at once, and the strong magnetism aids the reballing process, ensuring optimal solder component placement. Option: 1. SM 01: For iPhone 8 8P X Qualcomm. 2. SM 02: For
US$ 124.95
US$ 119.95