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DC unified output waveform display
0 megapixel image sensor with a magnification ratio of up to 600X is excellent for viewing
using the Barlow lenses
Air Intake
don't need add tin to protect solder
Amaoe BGA Reballing Stencil Qualcomm MTK CPU MQ:1-MQ:6 Option:MQ:1-6(6pcs) DC unified output waveform displayAmaoe MQ1 MQ2 MQ3 MQ4 MQ5 MQ6 reballing stencil for Qualcomm MTK CPU RAM soldering repair. 0. 12MM High quanlity CPU RAM BGA reballing Solder template stencil for SDM710 SDM845 SDM660 SDM636 MT6771V MT6739V MT6763V MT6757V. Amaoe MQ: 1 MQ: 2 MQ: 3 MQ: 4 MQ: 5 MQ: 6 For MTK Chip CPU BGA Stencil MT6771V SDM845 SDM710 MT6739V MT6757V SDM660 IC Solder Reballing Tin Pin Heating Template. Features: 1. Deformation resistant material. 2. Precise pins
