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Ships within 48 hours · Estimated delivery Sep 14 - Sep 19
The model of the EFI chip will be recognized automatically
San Francisco
It is made of Aluminum alloy structure
Tweezers storage module : Storage tweezers with various width
H300 HDMI Industrial Video Microscope Camera For Cell Phone Soldering Repair
MECHANIC XZ25/XZW25 BGA Solder Balls Motherboard Repair Tool Size:XZ25 0.20mm The model of the EFIMECHANIC Have Lead Welding Tin Bead Motherboard Chip Hard Disk Baseband Repair Soldering Tin Ball Repair Tools MECHANIC solder ball 25000PCS Bottle Notice: XZ25 is Lead solder ball, XZW25 is Lead free Solder ball. The BGA solder ball has the following characteristics: Meet EU ROHS and REACH standards. With high reliability, excellent mechanical properties, good thermal fatigue resistance and oxidation resistance. Purity and sphericity are very high,
US$ 151.72
US$ 569.52
